MB1-10AP

Intel Core i7 10510U Processor based Mini PC. SMARTSTATION brings you the most stylish, reliable low power, yet high performance Mini PC.

Description

Rugged & Versatile

Intel® Embedded Coffee Lake Xeon® & Core-I Model

  • Alternative module support,e.g PoE, COM, DisplayPort, DIDO, etc.
  • Fanless design
  • Sealed enclosure
  • Wide voltage DC input
  • Wireless option
  • Wide operating temperature

MB1-10AP

Fanless Embedded System with Intel® Apollo Lake N3350 / N4200 Processor (up to 2.5 GHz)

Powerful Apollo Lake Processor

  • N4200 (2M Cache, up to 2.5 Ghz, TDP 6W)
  • N3350 (2M Cache, up to 2.4 Ghz, TDP 6W)

1.48X Performance Improvement
(CPU Passmark)

Power Consumption Reduction

Lower Power Consumption Fanless Thermal
Design for Less Environmental Impact

Support 3 Ports LAN and 2 w/ PoE+ options

  • Total supports 3 x Giga LAN
  • 2 x LAN supports 802.3af and 802.3at PoE

Versatile Xpansion Modules

  • Support HDMI + VGA, DVI, or DisplayPort
  • Support power COM port &Digital I/O for iIoT application

MS-01VGA-D10

VGA Port Expansion Module

MS-01DVI-D10

DVI-D Port Expansion Module

MS-01DPN-D10

DisplayPort Expansion Module

MS-02COM-D10

Expansion Module with 2 x RS232 / 422 / 485 (support power 5V/12V)

MS-08DIO-T10

Expansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO)


Edge AI Accelerator

Intel® Movidius Myriad X for Edge AI

MB1-10AP with AI modules powered by Intel® Movidius Myriad X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.


Support Flexible Configuration For Dual Display

  • Support HDMI as primary display
  • Support secondary display (DisplayPort, DVI-D, or VGA) with Xpansion module options
  • Increase the flexibility to aim at target markets

Advanced Power Protection


-25~70oC Wide Temperature

MB1-10AP is designed in patented aluminum enclosure not only for aesthetic appearance but also for fan-less application in extreme temperature condition from -25℃ to 70℃.

Extreme Shock & Vibration Resistance

Shock Resistance

Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)

Vibration Resistance

Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)

Clear Installation Design


I/O Interface


Dimension (mm)

Category Type Description
SYSTEM Cpu Intel® Apollo Lake-M N4200 / N3350 Processor
CHIPSET Intel® SoC Integrated
SYSTEM MEMORY DDR3L 1866 MHz / 1 x 204-pin SO-DIMM / Max. 8GB (Non-ECC)
GRAPHICS Intel® HD Graphics
DISPLAY INTERFACE HDMI 1.4 / Optional DisplayPort/VGA/DVI-D by Expansion Module
STORAGE SLOT 1 x 2.5 HDD / SSD (Default w/ HDD Bracket) / 1 x mSATA
ETHERNET 2 x Intel® I210-IT Giga LAN (2 x Output PoE LAN: Optional) / 1 x Realtek RTL8154 LAN (Up to 480Mbps)
AUDIO Realtek® ALC662
I/O CHIPSET Nuvoton NCT6116D
TPM Nuvoton NPCT750AAAYX TPM2.0 (Optional)
EXPANSION SLOT LTE/Wireless: Mini PCIe Full size (USB / PCIe), w/ SIM Card Holder (w/ Full to Half size adapter plate) / Storage: mPCIe Full size (USB / PCIe / SATA)
INTERNAL SPEAKER 1 x Buzzer
INDICATOR Power Button / Power LED / HDD LED
FRONT I/O 1 x HDMI 1.4 / 4 x USB 3.0 / 2 x SMA Antenna (Optional for WiFi/LTE function) / 1 x Xpansion Module Door / 2 x RS232 / 422 / 485 (Support Power 5V / 12V)
REAR I/O 3 x RJ-45 / 1 x Mic-in / 1 x Line-out / 1 x 3-pin Terminal Block Power Input / 2 x SMA Antenna (Optional for WiFi/LTE function)
WATCHDOG TIMER 1~255 steps by software program
EDGE AI ENGINE (Optional) Single Movidius Myriad X VPU, and Intel® OpenVINO™ toolkit supported (Optional)
POWER REQUIREMENT POWER INPUT 8~24V Wide Range DC Input w/ Terminal Block Connectivity
POWER ADAPTER Optional
MECHANICAL MOUNTING Wallmount / 75 mm x 75 mm VESA Holes & Din Rail Mount Combo Kit (Optional)
DIMENSIONS (W X D X H) 6.9” x 4.1” x 2.2” (170 x 105 x 57 mm)
WEIGHT 1.3kg (2.8 lb)
MATERIAL Top cover: Aluminum Alloy / Bezel and chassis: Steel
THERMAL DESIGN Fanless
ENVIRONMENTAL OPERATING TEMPERATURE -25°C to 70°C (For non-PoE SKU) / -25°C to 60°C (For PoE SKU) / with 0.7m/s Air Flow and Wide Temperature Memory/Storage
STORAGE TEMPERATURE -40 ~ 85°C (-40 ~185°F)
OPERATING HUMIDITY 10% ~ 90% R/H (Non-condensing)
STORAGE HUMIDITY 10% ~ 95% @85°C non-condensing
VIBRATION RESISTANCE Operating: 5Hz~500Hz / 5Grms / 3Axis (w/ SSD, according to IEC60068-2-64)
SHOCK RESISTANCE Operating: 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)
CERTIFICATION CE / FCC Class A
OS OS SUPPORT Windows® 10 64-bit / Linux (support by request)
PACKING LIST PACKAGE 1 x Driver CD / 1 x Quick Installation Guide / 1 x Embedded System / 1 x Wall Mount Brackets (2PCS in 1 set) / 1 x 3 pin Terminal Block Power Connector / 1 x Full to Half Size mPCIe Card Adapter Plate