Description
Rugged & Versatile
Intel® Embedded Coffee Lake Xeon® & Core-I Model
- Alternative module support,e.g PoE, COM, DisplayPort, DIDO, etc.
- Fanless design
- Sealed enclosure
- Wide voltage DC input
- Wireless option
- Wide operating temperature
MB1-10AP
Fanless Embedded System with Intel® Apollo Lake N3350 / N4200 Processor (up to 2.5 GHz)
Powerful Apollo Lake Processor
- N4200 (2M Cache, up to 2.5 Ghz, TDP 6W)
- N3350 (2M Cache, up to 2.4 Ghz, TDP 6W)
1.48X Performance Improvement
(CPU Passmark)
Power Consumption Reduction
Lower Power Consumption Fanless Thermal
Design for Less Environmental Impact
Support 3 Ports LAN and 2 w/ PoE+ options
- Total supports 3 x Giga LAN
- 2 x LAN supports 802.3af and 802.3at PoE
Versatile Xpansion Modules
- Support HDMI + VGA, DVI, or DisplayPort
- Support power COM port &Digital I/O for iIoT application
MS-01VGA-D10
VGA Port Expansion Module
MS-01DVI-D10
DVI-D Port Expansion Module
MS-01DPN-D10
DisplayPort Expansion Module
MS-02COM-D10
Expansion Module with 2 x RS232 / 422 / 485 (support power 5V/12V)
MS-08DIO-T10
Expansion Module with 8-bit Isolated DIDO (4 x DI, 4 x DO)
Edge AI Accelerator
Intel® Movidius™ Myriad™ X for Edge AI
MB1-10AP with AI modules powered by Intel® Movidius™ Myriad™ X creates the possibility to be implemented in more Edge AI solutions, for example, traffic flow monitoring and real-time decision, manufacturing yield rate improvement via AI algorithm, remote healthcare service, and efficient transportation.
Support Flexible Configuration For Dual Display
- Support HDMI as primary display
- Support secondary display (DisplayPort, DVI-D, or VGA) with Xpansion module options
- Increase the flexibility to aim at target markets
Advanced Power Protection
-25~70oC Wide Temperature
MB1-10AP is designed in patented aluminum enclosure not only for aesthetic appearance but also for fan-less application in extreme temperature condition from -25℃ to 70℃.
Extreme Shock & Vibration Resistance
Shock Resistance
Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
Vibration Resistance
Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
Clear Installation Design
I/O Interface
Dimension (mm)
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